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VOID FORMERS

Polystyrene is uniquely suited to the construction industry due to its insulation properties, compressive strength, and low density. Specific applications include underfloor void formers and wall cavities, reducing insulation requirements and saving costs on other expensive materials, such as concrete.

Insulation properties and compressive strength are a factor of:

HEAT TRANSFER CALCULATIONS

Thickness (mm)

Density (kg/m³)

Thermal Cond. (W/m.K)

Thermal Trans. U (W/m².K)

Thermal Resist. R (m².K/W)

Temp. diff. (⁰C)

Heat Transfer (W/m²)

50

15

0.038

0.760

1.32

15

11.40

125

15

0.038

0.304

3.29

15

4.56

Thickness (mm)

Density (kg/m³)

Thermal Cond. (W/m.K)

Thermal Trans. U (W/m².K)

Thermal Resist. R (m².K/W)

Temp. diff. (⁰C)

Heat Transfer (W/m²)

50

20

0.035

0.700

1.43

15

10.50

125

20

0.035

0.280

3.57

15

4.20

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